High heat dissipation aluminum heat sink substrate with an integrated structure of aluminum base substrate and heat sink.
The "Aluminum Heat Sink Substrate" is a substrate that layers a high thermal conductivity insulating layer and circuits onto extruded aluminum heat sink material. It features surface roughening effects and weather resistance due to anodizing treatment, securing more than five times the surface area compared to conventional products. By combining with high thermal conductivity resin, it offers heat dissipation specifications that far exceed those of conventional products. There is absolutely no thermal transport loss, unlike retrofitted heat sinks. It also enables cost reduction in assembly due to its integrated structure, leading to a decrease in total costs. 【Features】 ■ Significantly improved heat dissipation characteristics ■ No thermal transport loss ■ Increased design flexibility for fins ■ Increased design flexibility for enclosures ■ Reduction in assembly costs ■ No need for material procurement *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Features】 - The thickness, pitch, and length of the fins can be customized. - The type of insulation layer can be selected according to the substrate specifications. - Multi-circuit and high current options are available. - During prototyping, high flexibility in external shape processing can be achieved using an NC router. - Cost reduction is possible during mass production with mold extraction. - We support everything from prototyping to mass production, including component mounting. *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Practical Examples】 ■General-purpose LED star board ■LED light bar board ■LED downlight board ■Interposer board for power ICs *For more details, please refer to the PDF document or feel free to contact us.
Company information
TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.
