System on Module equipped with Intel(R) MAX(R) 10 FPGA
This product is a compact System on Module equipped with an Intel® MAX® 10 FPGA and a Nios® processor along with peripheral interfaces. It is a small type measuring 30×40mm and can be embedded with a single connector. It has a wide operating temperature range, making it suitable for harsh operating environments such as industrial equipment. Please feel free to contact us if you have any inquiries. 【Features】 ■ Compact and lightweight ■ Eliminates concerns about discontinuation ■ Usable from prototyping to mass production ■ Customizable ■ Uses 10M25 *For more details, please download the PDF or feel free to contact us.
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basic information
【Specifications】 ■FPGA: 10M25DAF256I7G ■RAM: DDR2 128MByte ■ROM: QSPI Flash 64MByte ■Clock: 50MHz×2 crystal oscillator ■Connector: FX10-120P-SV (Hirose) 120pin Up to 90 general-purpose IO ports ■Expansion Connector: DF40C-30DP-0.4V (Hirose) 30pin Up to 22 general-purpose IO ports ■Debug I/F: JTAG (connected to the connector) ■Power Supply Voltage: -3.3V±5% ■Current Consumption: TBD ■Operating Temperature Range: -40℃ to 85℃ (without condensation) ■External Dimensions: 40mm×30mm *For more details, please download the PDF or feel free to contact us.
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Our company engages in hardware development and printed circuit board design, as well as transmission line analysis and EMS business. We provide solutions that meet our customers' needs from specification consideration to design, assembly, and packaging, from any angle. Please feel free to consult us if you have any requests.
![Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].](https://image.mono.ipros.com/public/product/image/1ab/2001482620/IPROS9539451614471571514.jpg?w=280&h=280)
