List of Board to Board Connectors products
- classification：Board to Board Connectors
1～45 item / All 271 items
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
The Same Sky connector product line has newly introduced pin headers, pin sockets, and box headers.
- Board to Board Connectors
- connector
The Same Sky connector product line now features new pin headers, pin sockets, and box headers.
The Same Sky connector product line now features new pin headers, pin sockets, and box headers. We offer 1 to 2 row types with a pitch of 2.54mm, available in 1 to 40 pins. Type: Pin Header / Pin Socket / Box Header Pitch: 2.54mm Direction: Vertical (Straight) Number of Pins: 1 to 40 Rated Voltage: 250Vdc Rated Current: 3A Mounting Type: Through Hole https://samesky.co.jp//SS-Products-connector-RectangularConnector.html
Providing a high-density and slim solution for interconnecting with SI performance!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Designed for internal wiring, enabling support for artificial intelligence (AI) and machine learning applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Dramatic reduction of heat source temperature, increased output, and miniaturization achieved by FGHP heat spreader!
- Board to Board Connectors
A high-speed solution that demonstrates SI performance up to 32Gbps and has a roadmap to 56Gbps!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Implementing an optimized direct-to-cable connector system to maximize system performance!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Output through a 0.50mm SMT plug and thin cable assembly without going through the PCB!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Robust machine design consistently achieves stability and reliability through external fitting!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Integrate power circuits, ground circuits, and high-speed data connections into a single connector!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Improve the connection efficiency of various increasing in-vehicle devices such as cameras, radar, turn indicators, and mirror defrosters!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Adopting modular design! It is possible to configure and provide multiple patterns of form factors.
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Ensures high reliability with a 2-point contact structure! Increases the maximum operating temperature to 125°C, suitable for automotive applications.
- Board to Board Connectors
The best selection of board-to-board connectors! They also make a strong presence in the automotive field!
- Other Connectors
- Board to Board Connectors
![[KEL] Special Feature on Connectors...](https://image.mono.ipros.com/public/default/object/noimage_l.gif?w=280&h=280){kind=small}
It plays a role in devices related to infrastructure that supports the lives of modern people.
- Board to Board Connectors
1.27mm x 1.27mm pitch, 0.4mm square pins, 4-72 connected pin headers, 2 rows (surface mount type)
- Board to Board Connectors
1.27mm pitch, 0.4mm square pin, 2-36 connected pin header right angle (surface mount type)
- Board to Board Connectors
1.27mm x 2.54mm pitch, 0.4mm square pin, 4-72 stacked pin header for connection, 2 rows (surface mount type)
- Board to Board Connectors
1.27mm x 2.54mm pitch, 0.4mm square pins, 4-72 connected pin headers (surface mount type, 2 rows)
- Board to Board Connectors
0.4mm pitch pin, 4-36 connected pin header (surface mount type)
- Board to Board Connectors
0.4mm pitch pin header for stacking with 4-36 connections (surface mount type)
- Board to Board Connectors
1.27mm x 1.27mm pitch, 0.4mm square pins, 4-72 stacked pin headers for connection, 2 rows (surface mount type)
- Board to Board Connectors
0.4mm pitch pin header for stacking connections of 4-36 (surface mount type)
- Board to Board Connectors
We design, develop, and manufacture I/O and waterproof cables in-house! We can provide solutions that offer advantages in terms of quality and cost.
- Board to Board Connectors
We utilize our unique routes to investigate domestic and international inventory of market-distributed products. *We have a wide range of achievements! We find inventory from around the world through ...
- Board to Board Connectors
High-reliability RF spring contact and reflow nut
- Board to Board Connectors