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  6. OCP compatible KickStart connector system

OCP compatible KickStart connector system

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last updated:Mar 26, 2026

レスター 本社
レスター 本社
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An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!

The "KickStart Connector System" creates an all-in-one cable-based connection system for boot drives with cables, combining power and signal circuits into a single cable that is flexible and easy to implement. It complies with the SFF-TA-1036 standard. The Open Compute Project (OCP) recommends this system with M-PIC specifications for boot peripheral connectors optimized for cables. The KickStart cable assembly and connectors reduce the need to manage multiple cables by integrating power and signal circuits into a single, easily installed cable assembly. 【Features and Benefits】 ■ Standardized server boot drive connection ■ Power and signal circuits in a single cable assembly ■ Slim, robust design *For more details, please download the PDF or feel free to contact us.

    Board to Board Connectorsconnectorconnector
OCP

OCP compatible KickStart connector system

OCP 対応 KickStartコネクターシステム1.png
OCP 対応 KickStartコネクターシステム1.png OCP 対応 KickStartコネクターシステム2.png OCP 対応 KickStartコネクターシステム3.png OCP 対応 KickStartコネクターシステム4.png OCP 対応 KickStartコネクターシステム5.png OCP 対応 KickStartコネクターシステム6.png
  • Related Link - https://www.restar-ele.com/business/electronic/mol…
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【Other Features】 - Reduces the need to manage multiple cables by providing an easily implementable single cable solution for boot drive connections. - Enables a simple hybrid cable that is compatible with the Silver 1C cable receptacle. - Offers robust mechanical design. - Maximizes space by using a low-profile design. - Simplifies system design and procurement as an OCP M-PIC standard. *For more details, please download the PDF or feel free to contact us.

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【Industry-Specific Applications】 ■Server & Storage *For more details, please download the PDF or feel free to contact us.

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Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).

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"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.

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レスター

レスター 本社

Electronic Components and Semiconductors

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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.

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