Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].

We are currently offering materials that explain the comparison of thermal vias and copper pins in terms of thermal conductivity, as well as the effects of changing the filling materials inside TH.

We are pleased to present materials introducing "substrates that dissipate heat faster." This document provides a detailed comparison of the structural differences between thermal vias and copper pins, noting that while their cross-sections may appear similar, the filling materials inside the thermal vias differ. It also includes information on "high thermal conductivity substrates" and more. The explanations are supported by graphs, tables, and formulas, making the content easy to reference. We encourage you to download it and read through it. [Contents] ■ Structural comparison of thermal vias and copper pins ■ What are high thermal conductivity substrates? ■ Comparison of thermal conductivity between thermal vias and copper pins ■ Effects of changing the filling material in thermal vias *For more details, please download the PDF or feel free to contact us.

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