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  1. Home
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  3. Electronic Components and Modules
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  5. Printed Circuit Board
  6. Business Introduction: Printed Circuit Board Design

Business Introduction: Printed Circuit Board Design

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last updated:Aug 24, 2022

羽野製作所
羽野製作所
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25 qualified national certification holders in printed circuit board manufacturing skills! Introducing available circuit board designs!

We would like to introduce the types of circuit board designs that our company can handle in "Printed Circuit Board Design." We can accommodate circuit board designs such as "high-speed digital" and "performance boards for semiconductor testing equipment." Based on small-lot production of various types, we handle the design and manufacturing of high-density, multi-layer printed wiring boards, as well as component mounting, assembly, and performance testing. 【Supported Circuit Board Designs】 ■ High-speed digital ■ Mixed digital & analog ■ High voltage, high current boards ■ Performance boards for semiconductor testing equipment *For more details, please refer to the PDF materials or feel free to contact us.

    Printed Circuit BoardCircuit board design and manufacturing
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Business Introduction: Printed Circuit Board Design

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  • Related Link - https://hano-ss.co.jp/?page_id=197

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basic information

【Design CAD】 ■Altium 1 unit ■CADLUS 10 units ■ALLEGRO 1 unit ■EXPEDITION 1 unit *For more details, please refer to the PDF document or feel free to contact us.

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For more details, please refer to the PDF document or feel free to contact us.

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Hanoh Manufacturing Co., Ltd. Business Introduction

Hanoh Manufacturing Co., Ltd. Business Introduction

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羽野製作所

羽野製作所

Industrial Electrical Equipment

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Hano Manufacturing Co., Ltd. has manufacturing facilities capable of in-house integrated production of printed circuit boards, focusing on small-batch production of various types. We handle the design and manufacturing of high-density, multi-layer printed circuit boards, as well as the development of electronic products, assembly, and performance testing. We also design and produce various nameplates, film sheets, and panel casing processing that correspond to the exterior of electronic devices, aiming for comprehensive coordination in electronic device development.

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