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  6. "Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

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last updated:Jul 28, 2023

函館電子
函館電子
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Challenging the limits of ultra-small diameter bumps! Achieving the world's smallest level 25um crimp diameter bump with compact, high-density mounting technology!

Hakodate Electronics Co., Ltd. is engaged in the development of fine-pitch gold stud bump processing technology and the development of mounting structures utilizing gold stud bumps through prototype development. By advancing the technology for miniaturization and fine-pitching of Au stud bumps, we achieve the world's smallest level of 25μm bonding diameter bumps. 【Bump Diameter Comparison】 ■ Bump Bonding Diameter (Bump Pitch) - 88μm (90μm) - 61μm (70μm) - 51μm (60μm) - 40μm (50μm) - 25μm (28μm) *For more details, please feel free to contact us.

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函館 製品.GIF

"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

函館 製品.GIF
函館 製品.GIF
  • Related Link - http://www.hakoden.co.jp/process/#c

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【Bump Pitch Array】 ■36μm ■34μm ■32μm ■30μm ■28μm *For more details, please feel free to contact us.

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Hakodate Electronics Co., Ltd. Company Profile

Hakodate Electronics Co., Ltd. Company Profile

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[Introduction to Manufacturing Process] Au Stud Bump

[Introduction to Manufacturing Process] Au Stud Bump

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函館電子

函館電子

Electronic Components and Semiconductors

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Hakodate Electronics Co., Ltd. is engaged in semiconductor assembly and LED testing, focusing on gold stud bump processing. We have established a consistent line for semiconductor back-end processes and an LED probe inspection sorting line, maintaining quality in an environment with temperature and humidity control and measures against electrostatic discharge. We cater to a wide range of needs from development prototypes to mass production, so please feel free to consult with us.

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