"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology
Challenging the limits of ultra-small diameter bumps! Achieving the world's smallest level 25um crimp diameter bump with compact, high-density mounting technology!
Hakodate Electronics Co., Ltd. is engaged in the development of fine-pitch gold stud bump processing technology and the development of mounting structures utilizing gold stud bumps through prototype development. By advancing the technology for miniaturization and fine-pitching of Au stud bumps, we achieve the world's smallest level of 25μm bonding diameter bumps. 【Bump Diameter Comparison】 ■ Bump Bonding Diameter (Bump Pitch) - 88μm (90μm) - 61μm (70μm) - 51μm (60μm) - 40μm (50μm) - 25μm (28μm) *For more details, please feel free to contact us.
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【Bump Pitch Array】 ■36μm ■34μm ■32μm ■30μm ■28μm *For more details, please feel free to contact us.
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![[Introduction to Manufacturing Process] Au Stud Bump](https://image.mono.ipros.com/public/catalog/image/01/7c8/714946/IPROS20673739369247710424.jpeg?w=120&h=170)
Company information
Hakodate Electronics Co., Ltd. is engaged in semiconductor assembly and LED testing, focusing on gold stud bump processing. We have established a consistent line for semiconductor back-end processes and an LED probe inspection sorting line, maintaining quality in an environment with temperature and humidity control and measures against electrostatic discharge. We cater to a wide range of needs from development prototypes to mass production, so please feel free to consult with us.