We achieve narrow GAP implementation and miniaturization of high-quality implementation boards.
We support the implementation of small chip components that are essential for miniaturizing substrates, as well as their narrow gap mounting. Our company has contributed to the miniaturization of Sony products by pursuing high-density mounting technology. We provide high-quality support for high-density mounting, such as the implementation of 0402 size components used in mobile devices like smartphones. Additionally, we can also accommodate even smaller 0201 and 03015 size component implementations. 【Features】 ■ Implementation of 0402 size components with narrow gaps ■ Capable of mixed mounting with large components (such as connectors) ■ Also supports the implementation of 0201 and 03015 size components ■ Equipped with solder printing inspection machines, pre-reflow inspection machines, and post-reflow inspection machines to ensure high quality *For more details, please refer to the PDF document or feel free to contact us.
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Download All Catalogs![High-Density Packaging Technology [Board Development & Mass Production Contracting]](https://image.mono.ipros.com/public/catalog/image/01/36b/566358/IPROS58540101563871254890.jpeg?w=120&h=170)
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Our company was established in April 2016 as a company that consistently handles various functions of manufacturing, including the development of core technologies, product design, production technology and manufacturing, parts procurement, logistics, and repair services. Based on the know-how, skills, and insights we have accumulated in the "manufacturing" of Sony products, we provide attractive products and services with high quality that our customers can trust. Every day, we receive various requests and consultations from customers in different industries, and our "team of manufacturing professionals" responds to even the most challenging demands with enthusiasm.
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