Design, structure, assembly technology of LED packages, and implementation technology onto substrates.
S10322
★New manufacturing methods (tandemization of multiple wavelengths, MCM, organic LEDs) ★Topics on phosphors (such as sialon phosphors) and key points of phosphor coating technology.
Speaker Mr. Gen Murakami, Ph.D. in Engineering, Representative Director of Genten Co., Ltd. Target Audience: Engineers, researchers, and relevant departments facing challenges with LED packages Venue: Tekno Kawasaki, 5th Floor, Room 5 [Kanagawa, Kawasaki] 10-minute walk from JR Nambu Line "Musashi-Mizonokuchi" Station Date and Time: March 29, 2011 (Tuesday) 12:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early.
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basic information
**Course Objectives and Aims** Semiconductor packaging technology is an essential technology that enhances the functionality of electronic devices, alongside semiconductor miniaturization technology and logic design technology. It continues to lead the world in semiconductor packaging materials and assembly equipment. In recent years, the technology has evolved from System in Package (SiP) using multi-layer stacking of devices to Multi functions in a Package (MiP), which integrates not only electronic conduction but also wireless (RF) and optical (photon) functions within a single package. As LED assembly technology becomes a crucial technology in the MiP era, we will take a comprehensive look at the current LED assembly technology and discuss future development directions and its impact on the market.
Price information
New members who apply for the first time by March 16 will receive an early bird discount price of 44,100 yen.
Price range
P2
Delivery Time
P2
Applications/Examples of results
**Program** 1. Introduction 2. LED Package Assembly Technology 3. LED Device Mounting Substrate Materials 3-1. How to Choose High Thermal Conductivity Printed Circuit Board Materials - Ceramic Substrates: HTCC, LTCC - Aluminum Materials - High Thermal Conductivity Copper Clad Laminates - High Reflectivity - Whitening 3-2. Challenges and Countermeasures for Soldering LED Elements - Issues with RoHS Compliant Soldering Materials - Recommended Optimal Reflow Temperature - Moisture Absorption of LED Element Resin and Resin Degradation / Gold Wire Fracture 4. Reliability Evaluation Methods for LED Elements 4-1. Reliability Issues - Microcracks Beneath Wire Bonding Areas - Solder Stress Balance Design for Solder Joints - Heat Dissipation Design for Maintaining Optical Characteristics 4-2. Points to Consider in Evaluation - Non-Destructive Testing Methods for Adhesion at Material Interfaces - Methods for Confirming the State of Intermetallic Compound Formation at Material Joints - Material Corrosion Due to Impure Ions 4-3. How to Evaluate - Ultrasonic Microscope - Cross-Section Observation Methods - Ultrasonic Flaw Detection Methods - Confirmation Methods for Impure Ion Adhesion Conditions 5. Domestic and International Markets for LEDs **[Q&A and Business Card Exchange]**
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![[Data] High-Density Mounting Specifications](https://image.mono.ipros.com/public/product/image/38c/2001502085/IPROS94455428813819361877.png?w=280&h=280)
