Design, structure, assembly technology of LED packages, and implementation technology onto substrates.
S00921
★Trend of Transparent Resin: Resin with Fluorescent Materials! Low Stress Resinization! High Refractive Index!
**Lecture Summary** Semiconductor packaging technology is an important technology that enhances the functionality of electronic devices, alongside semiconductor miniaturization technology and logic design technology. It continues to lead the world in semiconductor packaging materials and assembly equipment. In recent years, the technology has evolved from SiP (System in Package) using multi-layer stacking of elements to MiP (Multi functions in a Package), which integrates not only electronic conduction but also wireless (RF) and optical (photon) functions within a single package. As LED assembly technology becomes a crucial technology for the MiP era, this presentation will provide an overview of the current LED assembly technology and discuss future development directions and impacts on the market.
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【Speaker】 Mr. Gen Murakami, President of Mototen Co., Ltd., Ph.D. in Engineering 【Venue】 Kawasaki City Educational and Cultural Center, Room 1 【Date and Time】 September 27, 2010 (Monday) 12:30 PM - 4:30 PM
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1. Introduction 2. LED Package Assembly Technology 2.1 Types and Manufacturing Methods of LED Elements 2.2 LED Element Assembly Technology 2.3 Transparent Resins for LEDs 1) Characteristics and Types of Transparent Resins 2) Required Properties of Transparent Resins 3) Trends in Transparent Resins 2.4 Phosphor Coating Technology 1) Types of Phosphors and Required Properties 2) Key Points of Coating Technology - High Dispersion of Fine Particles and High Precision Coating Amount Control 3) Topics on Phosphors - Trends in Phosphors, Silicon Nitride Phosphors, etc. 3. LED Device Mounting Substrate Materials 3.1 How to Choose High Thermal Conductivity Printed Circuit Board Materials 3.2 Challenges and Countermeasures for Soldering LED Elements 4. Reliability Evaluation Methods for LED Elements 4.1 Reliability Issues 4.2 Points to Consider in Evaluation 4.3 How to Conduct Evaluation 5. Domestic and International Markets for LEDs [Q&A and Business Card Exchange]
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