From two dimensions to three dimensions: 3D packaging technology that greatly influences the performance of semiconductors.
◇Three-Dimensional Implementation Technology that Breaks Through the Limits of Miniaturization Chapter 1: Outlook and Challenges of Three-Dimensional Stacking Technology Chapter 2: Design Technology Chapter 3: TSV (Through-Silicon Via) Chapter 4: Bonding Technology Chapter 5: Interposer Chapter 6: Applications Chapter 7: Related Materials Chapter 8: Reliability
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"3D Semiconductor Packaging Technology" Book version: B5 size, 350 pages / PDF version (CD or download) ■ Author: Takashi Fukushima ■ Publisher: NTS
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List price: 72,000 yen + tax
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P2
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P2
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Manufacturing
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NTS selects reliable information from the overwhelming amount of information through seminars, publications, and literature information activities, and passes it on to the next generation. From abundance to certainty—that is the philosophy of NTS's activities.
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