It is possible to further reduce the implementation area compared to the WB method, enabling miniaturization on printed circuit boards.
"FCB&COF (Flip Chip Bonding) & COF (Chip on FPC)" is a method that forms bumps on the electrode part of a semiconductor chip and connects it by placing it directly on the electrodes of a printed circuit board (face down) while applying heat. It is also possible to implement it in combination with SMT, enabling miniaturization of the module. 【Features】 ■ Miniaturization on printed circuit boards is possible ■ Implementation in combination with SMT is also possible ■ Miniaturization of the module is possible *For more details, please download the PDF or feel free to contact us.
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【Other High-Density Packaging Technologies】 ■PoP (Package on Package) ■WB (Wire Bonding) ■COG (Chip on Glass) & OLB (Outer Lead Bonding) ■SMT (Surface Mount Technology) & Mixed Assembly with Other Processes *For more details, please download the PDF or feel free to contact us.
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Niigata Seimitsu Co., Ltd. primarily develops SMS business and is engaged in the overall development design, manufacturing, and maintenance of electronic devices and more. We possess various implementation technologies, development/design technologies, and evaluation/analysis technologies, so please feel free to consult us if you have any requests.
![[Data] High-Density Mounting Specifications](https://image.mono.ipros.com/public/product/image/38c/2001502085/IPROS94455428813819361877.png?w=280&h=280)
