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  6. Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)

Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)

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2054 Printed Circuit Board BOD

last updated:Dec 08, 2023

TECHNICAL INFOMATION INSTITUTE CO.,LTD
TECHNICAL INFOMATION INSTITUTE CO.,LTD
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Technical Specialized Books - Focusing on Automotive and 5G Applications

Unraveling substrate, wiring, mounting materials, and mounting technology aimed at "miniaturization and high density," "high speed and high frequency," and "flexibility." ■ Key points of this book ◎ Response to automotive and miniaturization for high density ◎ Response to 5G and high-speed communication ◎ Advancement of mounting and design technology

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2054

Book: Development and Implementation Technology of Printed Circuit Board Materials (2054BOD)

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■Table of Contents (Excerpt) Chapter 1: Future Trends of Implementation Components Chapter 2: Heat Resistance and Vibration Resistance of In-Vehicle Equipment Boards Chapter 3: Car Electronics and In-Vehicle Boards Chapter 4: Development of Board Materials for Power Electronics Devices Chapter 5: High Heat Resistance Implementation Technology for Power Electronics Applications Chapter 6: Development of High-Frequency Board Materials Chapter 7: Design of High-Frequency Boards Chapter 8: Development of Flexible Printed Wiring Boards Chapter 9: Development of Embedded Component Board Technology Chapter 10: Printed Boards for Compact and Thin Layer Applications Chapter 11: Improvement of Connection Reliability Chapter 12: Fine Wiring Formation Technology Chapter 13: Via Formation for Board Stacking Chapter 14: Noise Countermeasure Technology ------------------------------ ●Publication Date: May 29, 2020 ●Authors: 65 ●Format: A4 Size, 713 Pages Hardcover Edition: List Price: 88,000 yen (tax included) ISBN: 978-4-86104-787-9 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available List Price: 44,000 yen (tax included) ISBN: 978-4-86798-012-5 After receiving your order, we will perform simple printing and binding. ------------------------------

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■Table of Contents (Excerpt) Chapter 1: Future Trends of Implementation Components Chapter 2: Heat Resistance and Vibration Resistance of In-Vehicle Device Boards Chapter 3: Car Electronics and In-Vehicle Boards Chapter 4: Development of Substrate Materials for Power Electronics Devices Chapter 5: High Heat Resistance Implementation Technology for Power Electronics Applications Chapter 6: Development of High-Frequency Substrate Materials Chapter 7: Design of High-Frequency Substrates Chapter 8: Development of Flexible Printed Wiring Boards Chapter 9: Development of Component Embedded Substrate Technology Chapter 10: Printed Circuit Boards for Miniaturization and Thin Layering Chapter 11: Improvement of Connection Reliability Chapter 12: Fine Wiring Formation Technology Chapter 13: Via Formation for Substrate Stacking Chapter 14: Noise Countermeasure Technology -------------------------- ●Publication Date: May 29, 2020 ●Authors: 65 ●Format: A4 Size, 713 Pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-787-9   ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available       Price: 44,000 yen (tax included) ISBN: 978-4-86798-012-5       After receiving your order, we will perform simple printing and binding. --------------------------

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