COB high-density packaging contract manufacturing *Case study materials available for problem-solving
We accept module development, prototyping to evaluation, and mass production! We offer proposals with our unique know-how. *We are currently providing helpful materials such as the "High-Density Implementation Specification Sheet" and "Problem-Solving Case Studies."
We utilize the technology accumulated through various achievements to propose unique design and implementation know-how, covering package structures, joining methods, and material selection. We support flip chip technologies such as C4 joining, thermal compression bonding using NCP resin, ultrasonic GGI joining, and Au-Au thermal compression bonding. Additionally, we accommodate wire bonding using Au and AI wires, considering loop shapes for multi-stage and long-length wire bonding. We also offer contract development services, including substrate procurement. 【Features】 ■ Support for module development, prototyping to evaluation, and mass production ■ Proposals based on unique know-how in joining methods and material selection ■ Support for wire bonding and flip chip bonding ■ Information on other contract development services is also available *For more details, please refer to the PDF document or feel free to contact us.
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【Other Contract Development Services】 ■ Procurement of substrates (LTCC/FPC rigid-flex/metal substrates/Si substrates/interposers) ■ Support for modularization through SMT mixed mounting, as well as MEMS and optical devices ■ Wafer processing ■ Reballing and rework of BGA packages ■ Conducting environmental tests such as PCT and TCT collectively to verify reliability 【Case Studies for Problem Solving】 ■ Want to implement without voids → Design and create dedicated FC fixtures ■ Want to use FC but can only obtain chips individually → Form bumps on individual pieces using a bump bonder ■ Implementing at an overseas factory but yield is not improving → Reassess conditions within our company. Reproduce NG and point out areas for review *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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![[Data] High-Density Mounting Specifications](https://image.mono.ipros.com/public/catalog/image/01/b0e/786570/IPROS29961909267008707911.jpeg?w=120&h=170)
![[Case Study] COB High-Density Packaging](https://image.mono.ipros.com/public/catalog/image/01/508/405549/IPROS42415345949277545615.jpeg?w=120&h=170)
Company information
This is a company that handles contract manufacturing and sales of image monitoring systems, electronic devices, and system in package located in Okaya City, Nagano Prefecture.