Low softening point, ultra-high heat resistance, high thermal decomposition temperature, and low shrinkage bismaleimide-based resin!
"HR3030/3032/3070" is a bismaleimide resin characterized by low softening point, ultra-high heat resistance, high thermal decomposition temperature, and low shrinkage. When measured for molecular weight by GPC, "HR3030" is 670 Mw, "HR3032" is 1000 Mw, and "HR3070" is 660 Mw. 【Features】 ■ Low softening point ■ Ultra-high heat resistance ■ High thermal decomposition temperature ■ Low shrinkage ■ Bismaleimide resin *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Basic Information】 <Item: Measurement Method> ■HR3030 ・Softening Point: Flow Tester - 78℃ ・Melt Viscosity: ICI Viscometer / 150℃ - 1.3 dpa.s ・Gel Time: Hot Plate / 171℃ - 2600 sec ■HR3032 ・Softening Point: Flow Tester - 75℃ ・Melt Viscosity: ICI Viscometer / 150℃ - 1.7 dpa.s ・Gel Time: Hot Plate / 171℃ - 1600 sec ■HR3070 ・Gel Time: Hot Plate / 171℃ - 1500 sec *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Printech has established its corporate philosophy to contribute to the development of society, the enhancement of culture, and environmental conservation through its electronic circuit business. To realize this philosophy, we are committed to launching a wide range of products, from circuit materials to processed circuit products, with the full participation of the entire company. Moving forward, we are determined to deliver better products to our customers through the passion and efforts of all employees, from the development of new materials to advanced circuit processing products.
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