プリンテック Product Lineup

The "EPOX-AH7800 SHIRIES" is an adhesive that has high thermal conductivity and effective flexibility for stress relaxation due to its suitable formulation of inorganic fillers. Transportation can be done at room temperature, and for overseas shipments, please consult us separately. (Maximum temperature during transport: 50°C) Please feel free to contact us if you have any requests. 【Features】 ■ Easy to bend ■ Excellent stress relaxation *For more details, please download the PDF or contact us.

• Other polymer materials
• Composite Materials

"EPOX-AH7400 SHIRIES" is a high-heat-resistant and flexible adhesive that provides an adhesive layer with excellent thermal conductivity and heat resistance. By using an appropriate blend of inorganic fillers and incorporating a heat-resistant resin (VG3101L), it achieves high thermal conductivity and high heat resistance. It demonstrates high insulation and thermal conductivity when used on metal substrates. It is suitable for room temperature transportation, and inquiries for overseas shipments can be discussed separately. Please feel free to contact us if you have any requests. 【Features】 - Demonstrates high insulation and thermal conductivity when used on metal substrates - Shows good adhesion to both aluminum and copper foil - The cured product has a high Tg and excels in insulation resistance, especially at high temperatures - After being made into adhesive sheets, it is tack-free and flexible, offering excellent workability, among other features *For more details, please download the PDF or contact us.

• Composite Materials
• Other polymer materials

We offer a solid epoxy resin with improved flexibility and impact resistance, known as 'EPOX MK SR35K/SR3542', which is formulated with modified rubber. In addition to the rust prevention and chemical resistance properties of epoxy resin, it excels in film elongation and film formation due to rubber modification. Please feel free to contact us if you have any inquiries. 【Basic Physical Properties】 ■Flexural Strength: 114 MPa ■Flexural Modulus: 4890 MPa ■Growth Rate: 20% ■TG: 94℃ *For more details, please download the PDF or contact us.

• Composite Materials
• Other polymer materials

"EPOX MK R540" is a transparent, low-viscosity, flexible epoxy resin based on diglycidyl ester of anhydrous hexahydrophthalic acid. It is suitable for applications such as LED encapsulants, adhesives, and liquid crystal-related sealants. Please feel free to contact us if you have any inquiries. [Examples of Applications] ■ LED encapsulants ■ Adhesives ■ Liquid crystal-related sealants, etc. *For more details, please download the PDF or contact us.

• Composite Materials
• Other polymer materials

"EPOX MK R151" is a 100% reactive, plasticizable high-viscosity liquid epoxy resin modified with castor oil based on bisphenol epoxy A type. It can also be used as a flexible component, achieving high compressive strength and excellent impact resistance in the cured product through room temperature or heat curing. [Examples of Applications] ■ Flexible coatings ■ Electrical casting ■ Adhesives with high peel strength ■ Additives for high-pressure transformer insulation resin, etc. *For more details, please download the PDF or contact us.

• Composite Materials
• Other polymer materials

Our company offers a special epoxy resin, 'EPOX MK R710/R1710', which is characterized by its difficulty in crystallization due to its asymmetric structure and excellent storage stability. In terms of cured properties, it is equivalent to Bis-A type and has a lower viscosity than Bis-F type, making it easy to work with and suitable for improving the filling of fillers and other materials. Additionally, it exhibits good weight change during heating and is a highly functional original epoxy resin from our company, especially in terms of long-term reliability. 【Features】 ■ Low viscosity ■ Non-crystalline ■ Low shrinkage ■ Excellent storage stability *For more details, please download the PDF or contact us.

• Composite Materials
• Other polymer materials

This catalog is a comprehensive catalog featuring a wide range of products from circuit materials to circuit processed products handled by Print Tech Co., Ltd. We introduce various products such as castor oil modified epoxy resin and transparent, low-viscosity, flexible epoxy resin. [Featured Products] ■ High heat-resistant trifunctional epoxy resin 'TECHMORE VG3101L' ■ Bisphenol E type epoxy resin 'EPOX MK R710/R1710' ■ Castor oil modified epoxy resin 'EPOX MK R151' ■ Transparent, low-viscosity, flexible epoxy resin 'EPOX MK R540' ■ Rubber modified solid epoxy resin 'EPOX MK SR35K/SR3542', etc. *For more details, please download the PDF or contact us.

• Composite Materials
• Other polymer materials

"HR3030/3032/3070" is a bismaleimide resin characterized by low softening point, ultra-high heat resistance, high thermal decomposition temperature, and low shrinkage. When measured for molecular weight by GPC, "HR3030" is 670 Mw, "HR3032" is 1000 Mw, and "HR3070" is 660 Mw. 【Features】 ■ Low softening point ■ Ultra-high heat resistance ■ High thermal decomposition temperature ■ Low shrinkage ■ Bismaleimide resin *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials
• others

"EPOX AH-3353" is an adhesive with very high bonding strength, combining high heat resistance and flexibility. It is our original product that also possesses excellent flame retardancy (UL94 VTM-0). It can be used as a high heat-resistant adhesive for automotive applications, as well as for other high heat-resistant adhesive needs. 【Features】 ■ Very high bonding strength ■ Combines high heat resistance and flexibility ■ Excellent flame retardancy ■ Our original adhesive *For more details, please refer to the PDF document or feel free to contact us.

• glue

The "TECHMORE VG3101L" is a multifunctional epoxy resin that excels in high heat resistance, flexibility, and transparency durability. Examples of use include light-curing epoxy adhesives, resin compositions, laminates, displays, and the manufacturing of resin compositions. Being light-curable allows for curing at low temperatures, exhibiting excellent adhesive strength. Additionally, it can cure in a short time, making it highly productive, and the cured resin composition has high moisture permeability resistance. 【Features】 ■ High heat resistance ■ Flexibility ■ Transparency durability ■ Multifunctional epoxy resin *For more details, please refer to the PDF document or feel free to contact us.

• Other polymer materials
• others

"EPOX-AH357/3501/333" is a high-performance adhesive that combines flexibility. It excels in adhesion to polyimide and is used in substrates that require flexibility, such as flexible circuit boards (FCCL). Additionally, due to its characteristics, it can be produced in a roll-to-roll manner, enabling mass production and contributing to cost reduction. 【Features】 ■ High-performance adhesive with flexibility ■ Excellent adhesion to polyimide ■ Used in substrates that require flexibility ■ Capable of roll-to-roll production ■ Contributes to cost reduction *For more details, please refer to the PDF document or feel free to contact us.

• glue

At Print Tech Co., Ltd., we handle substrates for printed circuit boards that excel in heat resistance. We offer "BN300," which is used as a substrate for semiconductor substrates due to its high heat resistance characteristics, and "BN-LX," a high-reliability substrate for printed circuit boards that achieves environmental compatibility, high heat resistance (TG = 300°C), and low warpage (CTE = 6ppm). Please feel free to consult us if you have any requests. 【Product Lineup】 ■ BN300 ■ BN-LX *For more details, please download the PDF or feel free to contact us.

• Printed Circuit Board
• Other electronic parts
• Other machine elements