Introducing the features of engineering and processing. Presenting the company brochure.
"Electroless plating" involves applying a catalyst to the surface of a material and precipitating metal through a chemical reduction reaction. It does not use electricity due to the chemical reaction. There is a high degree of freedom in substrate pattern design, and it can utilize either reduction reactions or surface metal replacement reactions. 【Features】 ■ Gold plating is a replacement reaction, resulting in a thickness of approximately 0.03 to 0.05 μm. ■ Tends to have less variation compared to electroplating. ■ There are methods that utilize reduction reactions as well. *For more details, please download the PDF or contact us.
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basic information
【Electroless Nickel-Gold Plating Process】 1. Pre-treatment: Removal of dirt and oxide film 2. Catalyst application: Application of catalyst (palladium) on the copper substrate 3. Nickel plating: Reduction reaction treatment at approximately 90 degrees 4. Gold plating: Displacement reaction treatment 5. Inspection: Measurement by appearance and fluorescent X-ray *For more details, please download the PDF or contact us.
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Company information
Our company operates as a specialized manufacturer of surface treatment for printed circuit boards. In particular, to respond to the recent demand for short delivery times, we offer same-day processing even for small quantities and a variety of products, and for urgent orders, we complete them while you wait. Of course, we also provide same-day shipping to remote areas. Recently, we have quickly introduced a lead-free solder dedicated leveling machine (made in Japan) to accommodate lead-free solder, which has been well received. If you are facing any issues with surface treatment for printed circuit boards, please feel free to consult us.