High insulation, heat dissipation, and reliability! Thick copper ceramic substrates for power devices.
The "AMB substrate" is a substrate that joins thick copper to ceramics using the AMB (Active Metal Brazing) method. It is a thick copper ceramic substrate for power devices that has high insulation, heat dissipation, and reliability. 【Specifications】 ■ Base material: Silicon nitride (Si₃N₄) Aluminum nitride (AlN) Alumina (Al₂O₃) ■ Conductor thickness: 300 to 1000 μm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Application】 ■ Power Devices *For more details, please refer to the PDF document or feel free to contact us.
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Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.