High heat resistance and high strength! Ceramic wiring board using DPC plating method.
The "DPC substrate" is a ceramic wiring substrate that offers higher heat resistance and strength than conventional thick-film printed circuit boards. It is a substrate using the DPC (Direct Plated Copper) plating method, compatible with various materials such as alumina (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and glass. 【Specifications】 ■ Base material: Compatible with various materials including alumina, aluminum nitride, silicon nitride, and glass ■ Conductor thickness: 10 to 100 μm *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Plating Method】 <Comparison with Other Methods> ■Conductor Metals: Cu, Ni, Pd, Au, Sn Pb, Cr, Ag… ■Wiring Formation Method: Electroless Plating Electrolytic Plating ■Fine Line Resolution: Sharp ■Conductor Thickness: Thick application possible High degree of freedom ■Pattern Pitch: Line width / Spacing ■Through Holes: Possible High reliability, low resistance, etc. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.