A wiring board that enables miniaturization and cost reduction through the substrate of high current circuits.
The "thick copper wiring board" is a wiring board that uses copper plates in the wiring layer to respond to the "high current" demands of the electronics industry. By creating a substrate for high current circuits, it enables miniaturization and cost reduction. 【Features】 ■ Responds to the "high current" demands of the electronics industry ■ Uses copper plates in the wiring layer ■ Miniaturization ■ Cost reduction *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■ Thick Copper Products - Surface copper foil thickness: 200 to 500 μm - Solder resist can be flattened ■ Inner Layer Thick Copper Products (with Busbar) - Pattern copper foil surface foil thickness: 35/70/(105) μm - Inner layer copper plate thickness: 200 to 1000 μm - Post formation possible * For details, please consult separately. * For more information, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Located in Chino City, Nagano Prefecture, we are a printed circuit board manufacturer that offers services from design to implementation on circuit boards, from prototype development products to mass production. We have extensive experience in thermal management boards and can propose the most suitable materials and structures for our customers' applications. Additionally, in recent years, we have also been accommodating thick copper boards for high current applications with various substrates.