BGA pillow defect countermeasure solder paste
The 【PF305-153TO】 reduces pillow defects due to two features: 1. Excellent printability and soldering to BGA pads. 2. Compatible with flux type ROL0, it has a fast wetting speed and good wetting on oxidized BGA balls. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the product, please refer to the information below.
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basic information
Minimal degradation of the flux due to heating, maintaining wettability even under harsh conditions. 【General Specifications】 Alloy composition: Sn-3.0Ag-0.5Cu, particle size: 20-38μm, flux content: 11.5%, halogen content: 0.02%, viscosity/Ti value: 200Pa·s/0.60.
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BGA pillow defect countermeasure solder paste
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Lead-free solder paste "PF305-153TO"
Company information
Nihon Handa was founded in 1910 (Meiji 43) by our first president, Genkichi Asami, in the downtown area of Tokyo. While contributing to the modernization of Japan's industry, we have literally walked alongside soldering. Although our progress may not be flashy, it has steadily accumulated over time to reach the height of a century, marking our 100th anniversary. We sincerely thank our customers who have supported our products for these long 100 years. The times are changing rapidly and dramatically, making it increasingly difficult to foresee the future, but we wish to take on the next 100 years with the courage we have cultivated over our 100-year history. It is said that continuity is strength, and we are determined not only to continue but also to evolve our offerings. We humbly ask for your continued guidance and encouragement in the future.
