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  6. Copper bump substrate

Copper bump substrate

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last updated:Jul 25, 2018

アロー産業
アロー産業
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Introducing our product lineup, which covers everything from printed circuit board design and manufacturing to component assembly and assembly.

The "Copper Bump Substrate" is a product handled by Arrow Industry Co., Ltd. Our company is capable of creating products that meet customer needs due to our in-house integrated production of printed circuit boards (substrates). Furthermore, we collaborate with local companies to provide services ranging from printed circuit board design and manufacturing to component mounting and assembly. 【Our Features】 ■ In-house integrated production of printed circuit boards (substrates) ■ Collaboration with local companies ■ Services from printed circuit board design and manufacturing to component mounting and assembly ■ Proposals and provision of products tailored to customer needs *For more details, please refer to the PDF materials or feel free to contact us.

    Printed Circuit BoardCircuit board design and manufacturingOther machine elements
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Copper bump substrate

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  • Related Link - http://arrow-sg.co.jp/products/

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【Our Business Activities】 ■ Industrial Printed Circuit Boards ■ Lighting Printed Circuit Boards ■ High Heat Dissipation Printed Circuit Boards ■ Multilayer Metal Base and Metal Core Printed Circuit Boards ■ Hybrid Circuit Boards (Metal Base Circuit Boards + Rigid Substrates) ■ High Heat Dissipation Printed Circuit Boards for UV LEDs ■ Printed Circuit Boards for All Applications ■ Research and Development: Development of Inorganic Coatings in Response to UV Degradation and Thermal Countermeasures ■ Research and Development of Coatings to Prevent Degradation of Resist Due to Ultraviolet Light ■ Research and Development of Coatings to Enhance Heat Dissipation (Radiation) *For more details, please refer to the PDF materials or feel free to contact us.

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We handle everything from printed circuit board design and manufacturing to component assembly! <Company Introduction>

We handle everything from printed circuit board design and manufacturing to component assembly! <Company Introduction>

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Heat dissipation measures for UV-LEDs: "Metal (Copper, Aluminum) Bump Substrate"

Heat dissipation measures for UV-LEDs: "Metal (Copper, Aluminum) Bump Substrate"

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アロー産業

アロー産業

Electronic Components and Semiconductors

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If you need UV LEDs or high-brightness LED substrates, trust Arrow Industries! - We welcome inquiries about substrates from the development stage! - We can handle prototype and small lot production of special substrates! - For heat dissipation substrates (thick copper, aluminum/copper base, copper bumps, etc.), come to Arrow Industries; we can also handle assembly. - Research and development of high-reflective resist coatings to prevent degradation from ultraviolet light. Over 20 years of experience in the design and manufacturing of special substrates and heat dissipation substrates. We provide a consistent service from printed circuit board design and manufacturing to component assembly. We flexibly accommodate prototype boards and a variety of small lots, so please feel free to request materials or inquire for quotes.

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