Direct heat dissipation from the LED's neutral terminal! A substrate with a structure that efficiently releases heat.
The "Metal (Copper, Aluminum) Bump Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It features a structure that directly connects the heat dissipation fins of UV LEDs, high-brightness LEDs, and high-power semiconductors to the metal bump section, allowing heat to escape efficiently. 【Features】 ■ Direct heat dissipation from the neutral electrode of the LED ■ Structure that efficiently dissipates heat *For more details, please refer to the PDF document or feel free to contact us.
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If you need UV LEDs or high-brightness LED substrates, trust Arrow Industries! - We welcome inquiries about substrates from the development stage! - We can handle prototype and small lot production of special substrates! - For heat dissipation substrates (thick copper, aluminum/copper base, copper bumps, etc.), come to Arrow Industries; we can also handle assembly. - Research and development of high-reflective resist coatings to prevent degradation from ultraviolet light. Over 20 years of experience in the design and manufacturing of special substrates and heat dissipation substrates. We provide a consistent service from printed circuit board design and manufacturing to component assembly. We flexibly accommodate prototype boards and a variety of small lots, so please feel free to request materials or inquire for quotes.
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