Leave BGA rework and reballing, circuit board modification and repair, and X-ray inspection to us!
Our company was established to contribute to shortening development timelines and addressing labor shortages by managing necessary engineers, equipment, and outsourcing partners, utilizing a network across all areas related to electronic devices from product planning to design work. In terms of manufacturing, we handle a wide range of services from prototypes to small-lot mass production boards and OEM supply of mass-produced products. In our mobile phone repair business, we launched the "Visual System" to achieve a "paperless process" (preventing dust and work omissions) and to manage all products by serial number (including delivery and inventory management), enabling prompt and accurate repair services. 【Business Activities】 ■ Mobile phone repairs ■ Advanced repair services (BGA IC replacement) ■ Printed circuit board pattern design, prototyping, mass production, and component mounting ■ OEM supply of electronic devices (including manufacturing management) *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Service Contents】 ■Circuit Board Modification Service ・Jumper Wiring Work ・BGA Mounting after Jumper Wiring ■BGA Rework ■BGA Reballing ■X-ray Inspection (X-ray Inspection Equipment with CT Function) *For more details, please refer to the PDF document or feel free to contact us.
Price range
P1
Delivery Time
P2
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
