Flat and curved surface correspondence! The sticking operation is automatically controlled by PLC!
This product uses a adhesive mesh mechanism to hold the film substrate in a vacuum (patent pending) and attaches it to curved or flat cover glass or resin without bubbles. The attachment operation is automatically controlled by PLC. Optionally, a heater can be built into the lower stage (Max 150°C). 【Features】 ■ Holds the film substrate in a vacuum using an adhesive mesh mechanism (patent pending) ■ Can attach to curved or flat cover glass or resin without bubbles ■ Heater can be built into the lower stage (Max 150°C) - Optional *For more details, please refer to the PDF document or feel free to contact us.
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【Basic Specifications】 ■ Maximum substrate size: 300mm × 400mm (flat), 220mm × 330mm (R800mm curved) ■ Supported curves: convex, concave, 2.5D, 3D, S-shaped, depth 20mm ■ Pressure: up to 0.6MPa (pressure air 0.5MPa + atmospheric pressure) ■ Vacuum reach: 10Pa * For more details, please refer to the PDF document or feel free to contact us. There are multiple names for the mechanism, listed for search purposes: bellows, diaphragm, airbag.
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For more details, please refer to the PDF document or feel free to contact us.
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We solve your problems with bonding and sealing! - We propose a new bonding process that combines vacuum and atmosphere - Bonding of various shapes is possible. Prototyping and demo support are available, so please consult with us. At Joyo Engineering, as a top manufacturer of LCD bonding equipment and LCD cell gap formation equipment, we have produced many specialized devices that cater to various materials and process conditions, responding to our customers' needs. Based on numerous achievements, we have now released a new "vacuum bonding device." This device solves issues such as "air bubble inclusion in decorative panels with steps or slits," "design constraints of 2.5D/3D shapes," and "processing unevenness and positional deviation of thin substrates like films," enabling bonding of various shapes.