It is possible to achieve further miniaturization with two-fluid technology.
Hyper etching, which combines super etching and unique dual-fluid technology, achieves the same finish on both sides while accommodating cutting-edge fine pitch.
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basic information
We provide cutting-edge technology with vacuum etching and two-fluid etching.
Price range
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Applications/Examples of results
Compatible with the L/S 15μm generation.
Company information
Our company contributes to the industry as a development-oriented and proposal-oriented enterprise, based on plating and etching technology. The VCP-type copper plating equipment was developed by our company in 1997, ahead of the industry (with a Japanese patent obtained), and has now become the global standard technology. Additionally, in etching, we have developed a two-fluid method that responds to cutting-edge miniaturization (with patents obtained in Japan, South Korea, Taiwan, and China), which is rapidly spreading in the industry. We will continue to strive for new technology development and provide it to the industry. Please feel free to contact us if you have any requests.