Providing packaging tailored to the applications and characteristics of semiconductors and sensors!
"Electronic Component Bulk Storage Services" provides packaging suitable for various semiconductors and sensors based on their applications and characteristics. We offer a wide range of products tailored to specific needs, including "Partial Exposure Packages" that allow parts of devices or components to be exposed, as well as "Hollow Packages" and "Connection Type Packages." [Product Lineup] ■ Partial Exposure Package ■ Hollow Package ■ Connection Type Package ■ Transparent Resin Sealing Package ■ Noise Reduction Package *For more details, please refer to the PDF document or feel free to contact us.
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"ARS" is a Latin word that serves as the origin for "ART = art, skill." The company name "Ars" embodies our aspiration to be a group that pursues creative technology that radiates artistic brilliance. Ars Corporation is a subcontractor in the electronic device industry, specializing in semiconductor assembly, wafer reliability evaluation, and SMT implementation of electronic devices. The company was founded in 1972 as "Ars Precision Co., Ltd." focusing on the assembly of camera shutters. In 1979, we expanded into semiconductor packaging, in 1985 into SMT implementation of electronic devices, and further into wafer reliability evaluation in 1989. Manufacturing requires low cost, high quality, and the ability to respond to evolving technologies and diverse needs. This begins with a thorough commitment to every aspect, from manufacturing lead times to quality. We also consider the entire process from semiconductor back-end processes to electronic device assembly, and strive to provide technology and support systems that ensure our customers' peace of mind.
![High Implementation Reliability Package [Patented Technology]](https://image.mono.ipros.com/public/product/image/515/2000398360/IPROS4409363611273412044.jpg?w=280&h=280)
