[Application Example] Multi-layer Printed Circuit Board Pattern Analysis Technology through Substrate Cutting
Separated fourth layer pattern
Separation and visualization of wiring and metal patterns in multilayer printed circuit boards by layer.
We would like to introduce a technology that applies "smart X-ray." Our company has developed a technology that separates and visualizes the wiring and metal patterns within multilayer printed circuit boards by differentiating X-ray transmission images obtained by cutting the printed circuit board layer by layer. By utilizing this technology, it becomes possible to analyze the circuit patterns within multilayer printed circuit boards. 【Applicable Uses】 ■ Comparison of differences between manufactured printed circuit boards and design drawings in Gerber data ■ Pattern analysis of existing boards ■ Remanufacturing of printed circuit boards without manufacturing data *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Overview】 ■ Independently developed a device to remove components from printed circuit boards with pre-installed parts and to cut each layer. ■ Calculated the X-ray images of the original board and the board with one layer removed to restore the pattern of the removed layer as an image. * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. BeamSense is developing a new X-ray fluoroscopy device with the concept of being compact, simple, and highly visible.