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  6. [Application Example] Multi-layer Printed Circuit Board Imaging Technology Using X-ray Stereography

[Application Example] Multi-layer Printed Circuit Board Imaging Technology Using X-ray Stereography

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Image of multilayer printed circuit board visualization technology using X-ray stereo imaging (partially)

last updated:Nov 06, 2018

ビームセンス
ビームセンス
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We have developed a technology to separate and visualize metal patterns layer by layer.

We would like to introduce a technology that applies "smart X-ray." Our company has improved an X-ray transmission imaging device that has a proven track record in analyzing double-layer printed circuit boards. By using stereo imaging for three-dimensional measurement, we have developed a technology that separates and visualizes the wiring and metal patterns within multilayer printed circuit boards layer by layer. By utilizing this technology, it becomes possible to analyze the circuit patterns within multilayer printed circuit boards non-destructively. 【Applicable Uses】 - Comparison of differences between manufactured printed circuit boards and design drawings using Gerber data - Detection inspection of fragile areas that are difficult to identify with electrical testing - Analysis of existing board patterns for the manufacturing and design of new printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

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[Application Example] Multi-layer Printed Circuit Board Imaging Technology Using X-ray Stereography

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  • Related Link - http://beamsense.co.jp/

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【Overview】 ■ Development of an X-ray fluoroscopy device (X-ray inspection device) equipped with multiple imaging sensors to accommodate multilayer printed circuit boards and fine pattern inspection, necessary for layer-by-layer visualization. ■ Development of a high-precision calibration algorithm that enables relative measurement of the 3D position of 10μm imaging sensors. ■ Visualization technology utilizing X-ray CT methods. *For more details, please refer to the PDF document or feel free to contact us.

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[Application Example] X-ray Stereo Imaging Technology for Multi-layer Printed Circuit Board Visualization

[Application Example] X-ray Stereo Imaging Technology for Multi-layer Printed Circuit Board Visualization

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ビームセンス

ビームセンス

Industrial Electrical Equipment

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Utilizing new digital technology in the historically established field of X-ray imaging, we achieve realistic and easily understandable X-ray images. BeamSense is developing a new X-ray fluoroscopy device with the concept of being compact, simple, and highly visible.

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