Equipped with a variety of functions in a compact size.
This controller board is equipped with 12 gate signal outputs and can generate a variety of pulse patterns using a high-performance microcontroller from TI and an FPGA from Xilinx, allowing for simultaneous operation of two three-phase inverters. It features a compact design with a footprint of A6 size or smaller, making it suitable for both development and embedded applications. It also includes 12-bit AD conversion and CAN communication capabilities. 【Features】 ■ Compact size with a variety of functions Equipped with a high-performance microcontroller and FPGA in a small, embeddable size, it includes PWM output, AD conversion, and various communication functions. ■ Ability to build a development and debugging environment for control programs Can be connected to a PC via USB A separate HSDT-KIT-B can be used to establish a development and debugging environment. ■ Diverse I/O The small board has a variety of I/O options, including 12 gate signal outputs, 16 channels of AD input, 16 digital inputs, and 16 digital outputs.
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【Product Lineup (Partial Excerpt)】 <Control Devices / Development Environment> ■ Embedded Controller for Power Electronics Development: HECS-B/A ■ Controller for Multi-Gate Output Power Electronics: HEC1-S1-B ■ Power Electronics Development Support Kit: HSDT-KIT-B <Controllers / Options> ■ Expansion Interface Board for HECS: HC-EXIF-A ■ Operation Board for HECS: HC-OP-A <Main Circuit / Half Bridge / Bidirectional Switch> ■ Circuit Block with SiC Power Device: HGCB-2A-401350 ■ Circuit Block with GaN Power Device: HGCB-2B-401150 ■ Bidirectional Switch Circuit Block (SiC): HGCB-2C-401100 (Single Unit) HGCB-6C-401100 (3-Unit Set) <Main Circuit / H Bridge / Three-Phase Inverter> ■ Embedded Circuit Block H Bridge (SiC): HGCB-4A-401200 (Single Unit) HGCB-4×4-401200 (4-Unit Set) and more *For more details, please refer to the PDF document or feel free to contact us.
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Head Spring Co., Ltd. is engaged in various business support centered on development assistance in the field of power electronics. In particular, we excel in "the power to master advanced technologies" such as the utilization of next-generation power semiconductors like SiC and GaN, and we are committed to realizing the "module concept" that allows everyone to easily benefit from these advanced technologies. Furthermore, we leverage these capabilities to empower our customers in commercializing their new energy products.
