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  6. FPD various components, optical defect inspection equipment, unparalleled wide field of view.

FPD various components, optical defect inspection equipment, unparalleled wide field of view.

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FPD various components, optical defect inspection equipment

last updated:Nov 08, 2018

ワイ・ドライブ
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FPD various components, optical defect inspection equipment, unparalleled wide field of view, 5 times faster and higher resolution compared to conventional methods, ultra-wide field confocal type, high resolution of 1μm.

Ultra-wide field confocal type, high-resolution 1μm micro-defect inspection laser scanning imager. Conventional microscope optical systems and SEMs can observe narrow areas at high resolution but cannot easily observe wide areas. This challenge is addressed by the laser scanning imager. It can measure 3D shapes within a range of 50×50 mm. Measurement time: 1μm resolution approximately 35 seconds, 5μm resolution approximately 10 seconds. ● Measurement width: 0.8μm, depth: 5nm. ● Shape measurement is possible at a maximum tilt of 45 degrees. ● Can also detect defects such as scratches and deep holes. Features of the laser scanning imager: - A new observation device that overcomes the shortcomings of conventional microscopes, CCD cameras, and line sensors (no illumination device required). - Newly developed dedicated scanning lens with a wide observation area (over 100 times that of a microscope) and long working distance. - High-contrast laser confocal optical unit. - The first raster scanning method in laser confocal microscope optics (capable of acquiring large area images with long and large images, equipped with multi-scan functionality). - Outline specifications: High scanning resolution (up to 20,000 points per scan), scanning speed 4000 lines/second. The laser uses LD405nm (also available in 650 and 830nm). - This is the first device that allows enlarged images to be viewed on a computer monitor.

    Defect Inspection Equipment
FPD部材_光学欠陥検査2.jpg

FPD various components, optical defect inspection equipment, unparalleled wide field of view.

FPD部材_光学欠陥検査2.jpg
FPD部材_光学欠陥検査2.jpg 光学欠陥検査3.jpg 光学欠陥検査4.jpg 光学欠陥検査5.jpg
  • http://www.y-drive.biz/Optics.html
  • Special site - Product/service details - https://pr.mono.ipros.com/y-drive/product/

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basic information

Schematic diagram of ultra-wide field laser scanning imaging (using a confocal optical system equivalent to a laser microscope, achieving high speed and ultra-wide field with polygon mirror scanning and newly developed scanning lenses).

Price range

P7

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Applications/Examples of results

Applications of Laser Scanning Imager Observation and detection of surface defects on transparent films and glass Detection of micro-crack defects in ceramics Observation of delamination in deposited films Non-contact shape measurement of small-diameter lenses and compact molds, acquisition of precise 3D data over large areas Precise measurement of warping on small surfaces Measurement with precise interference fringes over large areas, inspection of scratches, and observation of objects that are difficult to see with optical microscopes.

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FPD various components, optical defect inspection equipment, unparalleled wide field of view, 5 times faster and higher resolution compared to conventional methods.

FPD various components, optical defect inspection equipment, unparalleled wide field of view, 5 times faster and higher resolution compared to conventional methods.

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Unmatched high field-of-view and high-resolution interference-type 3D laser scanning microscope (field of view: 30x50 mm)

Unmatched high field-of-view and high-resolution interference-type 3D laser scanning microscope (field of view: 30x50 mm)

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Telecentric fθ lens specifications for raster scan type laser exposure equipment (for small lot high precision exposure).

Telecentric fθ lens specifications for raster scan type laser exposure equipment (for small lot high precision exposure).

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ワイ・ドライブ

ワイ・ドライブ

Industrial Electrical Equipment

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Y-Drive Co., Ltd. is a company that develops and researches printed electronics technology. In addition to the production of electronic devices using inkjet methods, micro-nano molding methods, and printing methods, we also undertake the fabrication of fine 2D and 3D printed wiring/structures (fabrication of structures at scales below a few micrometers) and the development of various electronic circuit boards. We also accept contracts for various image processing software (camera systems and 3D sensor systems), FPGA design, electronic control software development, and embedded electronic device development.

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