Reducing labor costs in semiconductor manufacturing. Automation from product positioning, marking, identification to sorting!
The "TMK2000" is a marking and sorting device that can automatically perform package extraction, transfer to work holders, marking, OCR recognition, and good product sorting by being integrated into a semiconductor manufacturing line. Switching between databases via a touch panel makes it easy to change product types. 【Operation List】 1. Supply products individually extracted from the parts feeder 2. Centering adjustment of the products 3. Marking: Printing 4. Marking recognition: Distinguishing printed marks using OCR 5. Sorting into good products and defective products 6. Confirmation of supply readiness *For more details, please download the PDF or feel free to contact us.
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【Company Overview】 Our company is engaged in the research, development, and manufacturing of die bonders and automation equipment. We offer a lineup of die bonders for hoop frames compatible with both eutectic and epoxy, die bonders for power semiconductors, and die bonders for strip frames. *For more details, please download the PDF or feel free to contact us.*
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We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.