テクサス Company Profile

Practicing safety-first management.

We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.