Dai-bonder for tanzaku frames, compatible with both eutectic and epoxy, can also be used for both. Supports small chips (□0.15mm and above) and provides stable operation!
The "DBD4600S" is a die bonder for strip frames, capable of handling small chips starting from 0.15mm, providing stable operation. 【Specifications】 ■ Bonding process: Eutectic (DAF)/Epoxy/Combined machine specifications ■ Chip size: □0.15~1.0mm (Eutectic) ~3.0mm (Epoxy) ■ Bonding accuracy (XY): +/-35μm +/-25μm (when using backside recognition) ■ Bonding accuracy (Θ): +/-3° ■ Bond/Pick load: 30~200gf ■ Compatible work: Lead frames or substrates, carriers ■ Compatible width: Up to 70mm ■ Wafer size: 6 inches or 8 inches Disco ring or expand ring ■ Machine cycle time: 0.3 seconds/chip (Eutectic), varies by conditions ■ Transport method: Pin transport (Eutectic or combined specifications) Gripper transport (Epoxy dedicated machine) ■ External dimensions: 2,200x1,250x1,880mm ■ Weight: 1,200kg ■ Major options: Rotary bond head, backside recognition, collet cleaner, wafer map, strip map, etc. *For more details, please refer to the catalog or feel free to contact us.
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We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.