Clip Bonder - Die bonder for power semiconductors, chip and clip bonding, with optional appearance inspection and NG product punching unit support.
The "DCA1000" is a die and clip bonder for power semiconductors. (The device photo shows the configuration of a die bonder + clip bonder + appearance inspection mechanism) 【Specifications】 ■Joining Process Joining of solder-coated chips and joining of lead chips using ribbon solder ■Chip Size □1.0~6.0mm ■Lead Chip Size 8.5x2.5mm, 8.5x3.5mm, etc. ■Bonding Accuracy (XY) +/-150μm ■Bonding Accuracy (Θ) +/-5° ■Bond/Pick Load 40~200gf ■Compatible Work Lead Frame ■Compatible Width Up to 30mm ■Chip/Lead Supply Parts Feeder Supply ■Machine Cycle Time 0.9sec (1 chip) 1.6sec (2 chips) ■Transport Method Pin Transport ■External Dimensions 2,300x1,000x1,490mm ■Weight 1,200kg ■Main Options Backside recognition for chip orientation determination, appearance inspection, and punching of defective products *For more details, please refer to the catalog or feel free to contact us.
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We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.
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