We are currently presenting our lineup of die bonding devices and modification examples! Utilizing our unique technology, we conduct research, development, and manufacturing of die bonding and automation equipment!
Texas Corporation utilizes its unique technology to conduct research, development, and manufacturing of die bonding and automation equipment. The "Die Bonding Equipment Lineup and Modification Case Studies" is a collection that inherits the die bonding technology of Nidec Tosok Corporation, introducing semiconductor manufacturing equipment, including die bonding, based on that technology, along with modification case studies for existing machines. [Included Case Studies] ■ Product Lineup ■ Modification Case Studies | Hard Modifications - New rotary bond head for low-impact loads - Long-life modification of the bond head drive unit ■ Modification Case Studies | Soft Modifications - Post-bond recognition - Strip map, etc. ■ Modification Case Studies | Function Addition or Change, Improvement - Dispense specification addition modification - Backside recognition addition, etc. ■ Modification Case Studies | Response to Discontinued Products / Preventive Maintenance - Motor modifications - Overhaul jigs, etc. For more details, please refer to the catalog or feel free to contact us.
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We inherit the die bonding technology of Nidec Tosok Corporation and are implementing automation of semiconductor manufacturing equipment based on that technology. We are actively developing new projects and aim to contribute to the business of our partner companies through original product development. While further refining the technology established since our founding, we pursue the creation of products that combine high convenience and reliability, and we will continue to grow towards a valuable future.