It is an acrylic-based thermally conductive adhesive gel sheet.
- Being non-silicone based, it does not contain volatile components of "siloxane," preventing contact inhibition of electronic components and contamination of glass. - It uses excellent fillers as a filler, resulting in superior thermal conductivity. - It has excellent reworkability. - Due to its soft material, it conforms well to areas with significant irregularities. - It has excellent adhesion, reducing contact thermal resistance. - It excels in stress relief, reducing pressure on electronic components after embedding. - It is highly durable, demonstrating stable electrical insulation and thermal conductivity even after prolonged use.
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basic information
**Composition** Type of polymer: Acrylic-based adhesive resin Type of filler: Thermally conductive inorganic filler Color: White Release liner: Silicon-treated PET **Features** - Being non-silicone-based, it contains no volatile components of "siloxane," preventing contact inhibition of electronic components and contamination of glass. - Uses excellent fillers for thermal conductivity. - Superior reworkability. - Soft material that conforms well to large uneven surfaces. - Excellent adhesion, reducing contact thermal resistance. - Excellent stress relief, reducing pressure on electronic components after assembly. - Highly durable, demonstrating stable electrical insulation and thermal conductivity even after prolonged use. **Applications** Prevention of CPU thermal runaway Thermal management for IC chips Heat dissipation for LEDs Improvement of heat dissipation characteristics for various connections Heat dissipation for heat-generating parts of electronic and electrical devices *Efficiently transmits heat generated in semiconductor products to heat dissipation components such as heat sinks and metal covers.*
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Applications/Examples of results
Prevention of CPU overheating Thermal measures for IC chips Heat dissipation of LEDs Improvement of heat dissipation characteristics of various connection parts Heat dissipation of heat-generating parts in electronic and electronic devices *Efficiently transferring heat generated in semiconductor products, etc., to heat dissipation components such as heat sinks and metal covers.
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Company information
Leveraging our core technologies (with numerous patents), we have a proven track record of adopting our unique and top-tier products in a wide range of industrial materials, including construction materials, automotive, and electronic materials, focusing on adhesion, bonding, and joining. Additionally, by actively applying our proprietary technology, we aim to develop multifunctional sheets that achieve various functions such as heat resistance, heat dissipation, heat storage, conductivity, and barrier properties. Through a consistent system from development to sales, we are expanding new products in emerging functional areas, and our coordinators (technical sales) are committed to challenging customer needs and proposing new products.
