We introduce solder and solder paste containing flux that is compatible with low Ag and no Ag.
Currently, the introduction of low-silver solder with reduced Ag content and silver-free solder is progressing. The Ag in solder plays roles such as lowering the melting point of the alloy, improving wettability, and increasing mechanical strength, fatigue strength, and creep strength. We offer solder pastes and flux-cored solders compatible with low-Ag and no-Ag options, so please feel free to contact us. 【Product Introduction】 ■ Solder Paste (Bottle) Wettability-focused 1001 Series ■ Flux-Cored Solder Wettability-focused MFJ Series ■ Flux-Cored Solder Splash Prevention MYK Series *For more details, please feel free to contact us.
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For more details, please feel free to contact us.
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Examples of Low Ag and No Ag Solder Introduction ■ Components with large dimensions and high solder volume - Adoption examples: TVs, home appliances, LED lighting, battery packs ■ Items where stress is not applied to solder joints after mounting - Adoption examples: Coil parts of motors (no stress occurs as the coil bends)
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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.