Low-temperature film formation. High insulation, high barrier, uniformity!
"PEGASUS" is a mass production-compatible plasma CVD device that enables the formation process of insulating films and protective films for memory, power devices, and MEMS with precise and stable film deposition at low temperatures. It features a high level of safety due to its interlock mechanism and prevents contamination from the backside by using non-metal materials at the wafer contact points. 【Features】 ■ Low-temperature film deposition ■ Maintenance-friendly ■ Wafer handling ■ Footprint ■ Maintenance support, etc. *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■Size: W4000mm × D2000mm × H2000mm ■Plasma Source: ICP, RF Bias ■Gas Types: SiH4, O2, N2, HMDSO, NF3 ■Wafer Size: Up to φ12 inches (FOUP compatible) ■Film Deposition Rate: Up to 300nm/min *For more details, please download the PDF or feel free to contact us.
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Our company is engaged in the manufacturing and sales of semiconductor manufacturing equipment. We manufacture and sell the production-compatible plasma CVD equipment 'PEGASUS', which enables low-temperature, precise, and stable film formation processes for insulating films and protective films on substrates for memory, power devices, and sensor devices (up to φ300mm). Please feel free to contact us if you have any inquiries.