Supports wafers up to φ200mm! This is a plasma CVD system capable of both film deposition and etching.
The "210D model" is a film deposition device using Inductively Coupled Plasma (ICP). By replacing hardware on-site, it can be used as an inductively coupled plasma etching device in just a few minutes of work. With a compact body and a variety of options, it supports various applications such as thin film deposition and trench patterning. 【Features】 ■ Can be used as plasma CVD and RIE with simple hardware replacement ■ Approximately 30% smaller footprint compared to industry standards ■ Easy to operate with an intuitive graphic interface ■ Custom specifications can be accommodated upon request *For more details, please feel free to contact us.
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basic information
【Specifications】 ■ ICP-CVD deposition equipment and ICP-RIE dry etcher ■ Temperature range: -20℃ to 150℃ (modifiable with options) ■ Supports from coupon type to full wafers up to φ200mm ■ Batch processing of 2” wafers (7 pieces), 3” wafers (3 pieces), etc. is also possible ■ Gas piping: standard 8 lines (up to 11 lines with options) *For more details, please feel free to contact us.
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Applications/Examples of results
【Purpose】 ■Development of various products requiring dry etching and film formation.
Company information
Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for over 50 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en
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