Plasma CVD equipment "SHUTTLELINE(R) Series"

Compact and versatile! This is a high-performance device that can also be adapted for device evaluation processes.

The "SHUTTLELINE(R) series" is a flexible semiconductor manufacturing device that supports PECVD and dry etching for thin film deposition and failure analysis processes. It is compatible with RIE/ICP-RIE and PECVD/ICP-CVD, and is a compact device that can be used for various applications with a range of options. It is recommended for companies and academia that need a compact lab-scale device for R&D or laboratories, or for those looking for a device that can perform both film deposition and etching in one unit. 【Features】 ■ High-precision, damage-free etching process ■ Supports various wafer sizes and shapes, including dies, packaged dies, wafer pieces, and full wafers ■ The shuttle system eliminates the need for hardware changes for different sample sizes ■ Multi-functional support for film deposition/etching in one unit ■ Proven adoption worldwide, with local support through Plasma-Therm LLC's global network *For more details, please feel free to contact us.

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