Plasma CVD equipment
● Adopts a tray cassette system. 1. Achieves high throughput by reducing transport time. 2. Supports wafers from φ2 inches to φ8 inches by changing trays. ● Adopts a vacuum cassette chamber. 1. Achieves high throughput with a single vacuum exhaust per cassette. 2. Avoids contamination effects and prevents oxidation of the wafer surface. ● Further improves the reliability of the PD-220L reaction chamber, which has a rich track record of deliveries.
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basic information
The PD-220LC is a production-type plasma CVD system designed to form various silicon-based thin films (such as Si3N4 and SiO2). It employs a tray cassette system and a vacuum cassette chamber, achieving a high throughput of 3,000 4-inch wafers per month. This equipment enables the formation of passivation films and interlayer insulating films with excellent uniformity and step coverage in compound semiconductor processes.
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Applications/Examples of results
● Formation of silicon nitride film as a passivation layer ● Formation of silicon oxide film as an interlayer dielectric ● Formation of anneal cap film
Company information
We excel in the technology of thin film formation and processing at the nano to micro level, and we are well-regarded for providing equipment and technology for both research and development applications as well as production purposes. Additionally, we specialize in the optoelectronics field, particularly in light sources (LEDs and semiconductor lasers), which are expected to see market expansion in the future.
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