Substrate manufacturing device - Spray-type small etching device

Is it still manual? Introducing the "spray-type small etching device" suitable for testing and experiments in a tabletop size! Examples of use such as etching films!

The "Spray-Type Compact Etching Device" is a tabletop-sized device for etching processes, such as those used for printed circuit boards, as well as for developing processes. It uses the chemical reaction of etching solution (ferric chloride) to etch (chemically corrode, engrave) copper foil according to the circuit pattern. By replacing manual tasks with the spray-type compact etching device, reproducibility improves and work efficiency increases! It has also been used for etching during printing on films, making it versatile for various applications! 【Features】 - Simple processing by just inserting the substrate due to the conveyor transport method - Spray (single-sided) type allows for high-quality substrates in a short time - Recommended for small-scale etching for experiments and prototypes - Supports work sizes up to 150×200mm - Compact type that can be placed on a desk for use By using the optional dedicated exhaust treatment cover (MODEL ES-400FC), it can be connected to exhaust devices such as Sunhayato's ES-F2 and KS-8. *For more details, please contact us or download the PDF materials for further information.

Printed Circuit BoardOther semiconductor manufacturing equipmentCircuit board processing machine