Semiconductor device
This is a semiconductor device made from A5052P (aluminum material) with a thickness of 1.0mm and 1.5mm. The product in the photo is assembled from nine individually manufactured aluminum parts. The parts undergo processes of cutting, pre-processing, and bending, followed by anodizing treatment.
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basic information
Material: A5052P / t=1.0, t=1.5 Dimensions: 150 × 400 × 300 Process: Precision sheet metal processing Application: Semiconductor equipment
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Applications/Examples of results
This product is used as part of a semiconductor device.
Company information
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