Semiconductor device base
This is a precision sheet metal processing product made from SUS430 (hairline material) with a thickness of 1.0mm. The main process starts with punching, followed by pre-processing, stud welding, bending, and silk screening in that order. This product is used as a base for semiconductor equipment. The production time, including silk screening, is approximately 2 to 3 days for a lot of 100 units.
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basic information
Material: SUS430 / t=1.0 Process: Precision sheet metal processing, silk printing Application: Semiconductor equipment base
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Applications/Examples of results
This product is used as a base for semiconductor devices.
Company information
If it's about manufacturing, leave it to Higashi Kai Manufacturing. We have the technical capability to solve difficult products that other companies have turned down. We can provide consistent support from various processing to plating, painting, and silk printing. With our quick response and sincere approach, we will turn your ideas into reality. Precision sheet metal / Can manufacturing sheet metal / Press processing / Machining / Resin cutting processing / Plastic processing / Various assembly processing / Sheet metal welding / Can welding / Development, design / Assembly, installation
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