Introducing rework and reballing equipment for safe rework operations in a lead-free environment!
We would like to introduce the rework and reballing equipment we use. The "IR650A Rework System" is a modular type IR rework system designed for safe rework operations in a lead-free environment. Additionally, we have the lead-free compatible "IR550A Plus Rework System" using dynamic IR technology and a "Hybrid Rework System." 【Features (IR650A Rework System)】 ■ Modular type IR rework system ■ Supports safe rework operations in a lead-free environment ■ Compatible with a wide range of delicate mobile phone circuit boards to small PC circuit boards ■ Allows rework operations with simple operating controls *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Main Equipment】 ■IR650A Rework System ■IR550A Plus Rework System ■Hybrid Rework System *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Usage】 ■BGA Rework and Reballing *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs![[Main Equipment] Introduction of Rework and Reballing Equipment](https://image.mono.ipros.com/public/catalog/image/01/52e/464310/IPROS35016475984656650564.jpeg?w=120&h=170)
Company information
The impetus for our work on BGA rework was "environmental protection." Starting around 2002, we began to see a significant number of circuit board repairs that were impossible to fix while conducting mobile phone repair operations. When BGA (IC) was incorporated into mobile phones, adhesive (underfill) was used as a measure to prevent solder peeling. This adhesive reinforces the bonding between the circuit board and the IC, but due to aging and usage conditions such as drops, it can surprisingly crack easily. Later, these cracks can erode the solder of the IC, leading to functional failures. Since mobile phone circuit boards have many functions, the disposal cost for a single unit can be enormous. If IC replacement becomes possible, repairs can be conducted with just the cost of the IC and its replacement, allowing other components to be reused, which we believe connects this recycling technology to "environmental protection." Our company has been committed to creating a more environmentally friendly world through circuit board modification, repair, BGA reballing, and component regeneration long before the term SDGs became widely recognized, emphasizing the importance of the global environment.
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