Improving the overall capabilities of powder handling systems and achieving a production environment with less noise and vibration! Ultrasonic vibrations can be applied to structural components such as piping and metering supply in powder transportation.
In the field of powder handling, when issues arise due to bridging, rat-holing, or adhesion, it is necessary to install auxiliary powder discharge devices in a timely manner to prevent quality issues and production interruptions. By using Artec's innovative 'flowsonic' solution, we achieve an improvement in the overall capacity of powder equipment while creating a production environment with low noise and mechanical vibrations! By simply connecting an ultrasonic converter to the side of the hopper, ultrasonic micro-vibrations are generated throughout the inner walls of the hopper, preventing powder adhesion and ensuring flowability. It is possible to apply ultrasonic vibrations to various structural components such as piping, chutes, silos, and volumetric feeders in powder transport. 【Features】 ■ Prevents powder adhesion and ensures flowability ■ Creates a production environment with low noise and vibrations ■ Capable of applying ultrasonic vibrations *For more details, please refer to the PDF document or feel free to contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.