We have many years of manufacturing technology and know-how for HTCC multilayer ceramic packages!
We provide high-reliability ceramic packages customized for various applications, from standard packages for device evaluation to those tailored to customer requests. We can accommodate everything from single-layer ceramics to multilayer ceramics. Our packages are suitable for industrial equipment, communication equipment, MPUs, ASICs, high-frequency devices, and device evaluation. Please feel free to contact us with your requests. 【Our Strengths】 ■ 3D structure capability ■ Compatible with various soldering of metal fittings ■ Supports a wide range of plating, including electrolytic and electroless plating ■ Abundant standard tools available ■ Can deliver from small quantities, etc. *For more details, please download the PDF or feel free to contact us.
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【Other Semiconductor Packages and Substrates】 ■ Large substrates for wafer testing ■ Packages for image sensors ■ Flip chip packages for high-reliability ASICs *For more details, please download the PDF or feel free to contact us.
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Our company is engaged in the design, manufacturing, and sales of ceramic substrates and packages. Starting from the IC chip design, we can individually propose the structure and design of ceramic packages based on the customer's usage methods and basic requirements, so please feel free to consult with us.