Formic acid and hydrogen reduction compatible! Desktop type that can accommodate substrates up to 200mm x 200mm.
This is a tabletop vacuum solder reflow device compatible with both formic acid and hydrogen reduction. Despite its compact size, which is among the smallest in the industry, it supports atmospheric, nitrogen, and reducing atmospheres (formic acid or hydrogen), as well as vacuum reflow. Additionally, it features rapid heating and cooling through a water cooling system, making it suitable for research and development or prototyping. It flexibly accommodates various applications, including solder reflow, reduction treatment of metal oxide films, and sintering of paste materials. **Features** - Achieves zero flux residue by removing oxide films without using flux. - Reaches a maximum temperature of 400°C despite its tabletop size. - Standard support for atmospheric reflow, nitrogen gas purge reflow, and vacuum reflow. - Supports rapid cooling through a water cooling system. - The working area is gas shielded, allowing for use in processes sensitive to contamination and other critical processes. *For more details, please refer to the PDF document or feel free to contact us.*
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【Other Features】 - Optional support for formic acid reduction reflow and forming gas (hydrogen + nitrogen) reflow. - Heating is performed by an IR (infrared) heater from below, enabling precise and rapid heating. - By combining with an appropriate vacuum pump, a vacuum environment of up to 0.1 Pa (10^-3 hPa) can be achieved. - Equipped with a standard touch panel monitor, allowing for easy operation via touch controls. - Up to 50 temperature control programs with 50 segments (lines) can be registered in the main unit. - Various trigger modes are available, including elapsed time, chamber temperature, and chamber vacuum level. *For more details, please refer to the PDF document or feel free to contact us.
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P7
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For more details, please refer to the PDF document or feel free to contact us.
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![[Reflow Equipment Case Study] Temperature Variation within the Substrate](https://image.mono.ipros.com/public/catalog/image/01/ba2/675680/IPROS05055255908461765313.jpeg?w=120&h=170)
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We sell and provide maintenance for a benchtop vacuum solder reflow device that enables soldering without flux and voids, as well as a benchtop vacuum process high-speed heating furnace that achieves annealing in various chamber environments such as vacuum and process gas environments.