It is possible to investigate the degassing behavior of organic matter in a vacuum.
Epoxy resin is used as a semiconductor encapsulant, as well as an adhesive and for vacuum leak prevention both inside and outside vacuum devices. However, even after curing, heating may cause outgassing, which can negatively affect products and equipment. TDS (Thermal Desorption Gas Analysis) allows for monitoring outgassing components by heating the sample in high vacuum (1E-7 Pa) or while maintaining a constant temperature. Below, we present a case study investigating the outgassing behavior of epoxy resin using TDS with temperature maintenance.
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For detailed data, please refer to the catalog.
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Analysis of manufacturing equipment and components.
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Download All Catalogs![[Analysis Case] TDS Analysis of Epoxy Resin_C0568](https://image.mono.ipros.com/public/catalog/image/01/c0b/473653/IPROS34569365014984537296.jpeg?w=120&h=170)
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MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!
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